TSPF
Thermally Set Pad
Description
Thermally Set Pad (TSPF) is a thermal interface material that combines the advantages of low thermal resistance, electrical isolation, and thermally set properties. Based on the fluorine resin and specific ceramic filler, this product can be used as the interface material used in the electric component manufacturing of home appliances, electric motors, LED bulbs, power electronics, printed circuit boards, heat sinks and more. Compared with tradition thermal interface materials, TSPF provides more design freedoms, particularly in applications that require thinly shaped structures, high reliability, broad operating temperature ranges, and high thermal conductivity.
Features
- Excellent Thermal Conductivity
- Easy to Process
- Flexible Thickness – low thermal resistivity
- Broad Operating Temperature
- RoHS compliant
- Halogen free and lead-free process
Applications
- Home Appliances
- Electronic Devices
- Electric Motors/Automotive
- LED / High Brightness LED Module
Data Sheet