Thermally Conductive Board (TCB), or Insulated Metal Substrate, provides the advantages of high thermal conductivity, reliability and solder heat endurance. The TCB substrate is a sandwich structure, which includes layers of conductor, insulator and metal base. Traditionally, this insulator is made of epoxy, epoxy filled glass fiber, polyimide or other dielectric materials. However, these kinds of insulators could not meet the requirement in high-power electronic devices. The heat generated by these devices will accumulate and the life time and reliability of the end product will decrease.
Polytronics’ TCB product is not only a printed circuit board but also a heat transfer interface. The insulator is made of a unique polymer composite that combines epoxy resin and high thermal conductivity filler, and the thermal conductivity is up to 20 times higher than the traditional epoxy filled glass fiber system.